Semiconductor related equipment


Edge grip prealigner

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300 mm edge grip prealigner

Employs an edge grip mechanism



High level of cleanliness performance

Employs an edge grip mechanism that reduces particle contamination by not touching the bottom of the wafer

High speed, high accuracy

High speed and high accuracy through the use of high resolution absolute AC servo motors

High performance

Supports retention check via wafer grip sensor,

ESD measures with the use of electrically-conductive materials and conductive material treatments

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