Positioning Device
Edge Grip Prealigner
Features
- Edge grip mechanism to avoid contacting the back of a wafer for reducing particle generation.
- High-speed alignment allows 300mm wafer to process in less than 3 seconds alignment time and ±0.1°accuracy.
specification
| Item | Edge Grip Prealigner |
|---|---|
| Type | KWA-12-E |
| Wafer Size | 300mm |
| Alignment Time | Less than 3sec |
| Accuracy (Centering) | ±0.2mm |
| Accuracy (Alignment) | ±0.1° |
| Clean Class | Class1(0.1μm/cf) |
